Details

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Highlights

• Low viscosity epoxy potting compound for easy dispensing
• Designed for potting and bonding electronic and electrical components
• Non-corrosive to copper and sensitive electrical materials
• Minimal exotherm generation during curing
• Very low shrinkage for stable component protection
• Suitable for precision electronic assembly applications

Description

The 3M Scotch-Weld Epoxy Potting Compound DP270 (7100148745) is a low-viscosity epoxy potting compound formulated for electronic and electrical component protection and bonding applications.

Its easy-flow formulation supports efficient dispensing and complete encapsulation of components during potting operations. The compound is non-corrosive to copper and generates minimal exotherm during curing, helping protect sensitive electronic assemblies from thermal stress and material damage.

With very low shrinkage characteristics, it provides stable and reliable encapsulation performance, making it suitable for industrial electronic manufacturing, electrical assembly, and component protection applications.

Typical Properties