Details

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Details

Highlights

• Two-part epoxy potting compound designed for electronic and electrical applications
• Low viscosity formulation for easy dispensing, potting, and encapsulation
• Non-corrosive to copper, making it safe for sensitive electronic components
• Low exotherm during cure helps protect heat-sensitive assemblies
• Very low shrinkage reduces stress on components during curing
• Provides strong environmental protection against moisture, dust, and contamination
• Suitable for potting, encapsulating, and light bonding of electronic assemblies
• Black color offers good coverage and shielding appearance
• Supplied in a 200 mL Duo-Pak cartridge for controlled mixing and application
• Packaged 12 cartridges per case for industrial use

Description

The 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 (7000121252) is a low viscosity, two-part epoxy potting compound designed for protecting and encapsulating electronic and electrical components. It flows easily for potting applications and cures with minimal exotherm and very low shrinkage, helping to reduce stress on sensitive assemblies. The formulation is non-corrosive to copper, making it suitable for use in electronic devices and circuit protection. DP270 is widely used for potting, sealing, and protecting components from moisture, dust, and environmental exposure in industrial and electronic manufacturing applications.

Typical Properties