Details

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Details

Highlights

• Low viscosity formulation for easy dispensing and excellent flow into small or complex cavities
• Designed specifically for potting and encapsulation of electronic and electrical components
• Non-corrosive to copper, ensuring safe use with sensitive electrical parts
• Minimal exotherm reduces heat generation during curing, protecting delicate components
• Very low shrinkage maintains dimensional stability and reduces stress on assemblies
• Supplied in a 400 mL Duo-Pak cartridge for accurate mixing and controlled application

Description
The 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 (7100082565) is a two-part epoxy designed for potting and encapsulating electronic and electrical assemblies. Its low viscosity allows it to flow easily around components, ensuring complete coverage and protection. Engineered with minimal exotherm and very low shrinkage, it helps prevent thermal and mechanical stress during curing. Additionally, its non-corrosive nature makes it safe for use with copper and other sensitive materials. This makes DP270 an ideal solution for protecting circuits, connectors, and electronic modules in industrial applications.

Typical Properties