Details

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Details

Highlights

• Two-part epoxy potting compound designed for electronic and electrical applications
• Low viscosity formulation allows easy dispensing, flow, and complete encapsulation
• Non-corrosive to copper, making it safe for sensitive electronic components
• Produces minimal exotherm during cure, reducing risk of heat damage
• Exhibits very low shrinkage for reliable dimensional stability
• Provides clear finish for visual inspection of encapsulated components
• Suitable for potting, encapsulation, and bonding applications
• Packaged in a 48.5 mL Duo-Pak cartridge system for controlled mixing and application

Description
The 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 (7100148730) is a low-viscosity, two-part epoxy designed for potting and encapsulating electronic and electrical components. Its formulation ensures easy flow into tight spaces, allowing complete coverage and protection of delicate assemblies.

This compound is non-corrosive to copper and generates minimal heat during curing, making it ideal for sensitive electronic applications. With very low shrinkage and a clear finish, it provides reliable protection while allowing visual inspection of components after curing.

Typical Properties